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KJ Lesker evaporator

Overview

We have a KJ Lesker e-gun/beam evaporator available in the SNP shared-use facility (006 Spilker).

Key feature:

  • load-lock for cleanliness and faster pump down times (5-10 minutes per wafer)
  • Up to a single 6 inch wafer can be inserted into the deposition chamber. Smaller pieces and wafer fragments can also be mounted on the water cooled substrate puck.
  • An Ar ion source for cleaning the substrate immediately prior to metal deposition.
  • A substrate to e-gun source distance of 24 inches which reduces side wall accumulation for better liftoff results.
  • The substrate holder has tilt control which permits depositing materials at angles other than 90 degrees.
  • We allow gold (Au) in the chamber.
  • We allow wafers with patterned photo resists for lift-off processes.
  • We are currently avoiding evaporating magnetic metals (Fe, Cr, and Co) for the sake of users working with superconductors.
  • It has 8 pockets for different materials. We currently have it stocked with: Ti, Ta, Al, Au, Pd, Pt, Nb, and Ag. We will consider introducing additional materials based on user demand.
  • Please note that certain precious metals will be charged separately from the hourly usage of the instrument.

Contact Information

Shiva Bhaskaran

Research Examples

Lines written by the JEOL e-beam lithography system. Metal was deposited and then a lift-off process was used to remove the metal from the regions where the e-beam resist remained.

 

Cross shaped patterns of metal sandwiching an oxide layer. The metal was depositing in the Lesker Evaporator.


 

Getting Started

In order to become a qualified user on the tool, you need to follow each of these steps in the order as listed:

Resources