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Winter Closure

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Overview

Last updated: 9-December-2024

Stanford University's 2024 winter closure will be observed from Monday, December 23, 2024, through Friday, January 3, 2025. The following briefly describes what to expect at SNSF. If needed, SNSF staff will provide further updates through user mailing lists.

Table Notes:

  • Note 1: Complete shutdown of all administrative functions during winter closure (Badger requests, card key access, PTA updates). Expect slower processing times after the break.
  • Note 2: Instrument available to fully trained and qualified users who have gained independent after-hour access; no staff support or training during the winter break; card key authorization required for building and lab entry.
  • Note 3: Usage by pre-approved users only; contact staff for details; no staff support or training during the winter break; card key authorization required for building and lab entry.
  • Note 4: Complete shutdown.
    • Shutdown of Flexible and Nanopatterning Cleanrooms and associated instruments will be in effect from Friday, December 20, 08:00 until Tuesday, January 7, 08:00. No access permitted in between the dates.
    • Spectra TEM: End of day on Dec. 19, LN2 will be topped off and system will be available for use until 5pm, Dec. 20. The cryo cycle will automatically activate and the column conditioned. Spectra will be available starting Jan. 7.
InstrumentCoreTable Note
AdministrationAdministration1
SEM: TFS ApreoElectron & Ion Microscopy2
SEM: FEI MagellanElectron & Ion Microscopy2
SEM: Hitachi TM4000+Electron & Ion Microscopy2
SEM: Ion MillElectron & Ion Microscopy2
SEM/FIB: FEI Helios 600iElectron & Ion Microscopy2
SEM/FIB: TFS Hydra PFIBElectron & Ion Microscopy2
TEM: TFS SpectraElectron & Ion Microscopy4
TEM: FEI TecnaiElectron & Ion Microscopy2
TEM: FEI TitanElectron & Ion Microscopy2
XRD: PANalytical EmpyreanX-ray & Surface Analysis2
XRD: PANalytical Empyrean 2X-ray & Surface Analysis2
XRD: PANalytical X'Pert 2X-ray & Surface Analysis2
XRD: Multiwire LaueX-ray & Surface Analysis2
XRD: Bruker Single Crystal D8 VentureX-ray & Surface Analysis2
XCT: Zeiss Xradia 520 Versa X-ray CTX-ray & Surface Analysis2
Auger: PHI 700X-ray & Surface Analysis2
XPS: PHI VersaProbe 3X-ray & Surface Analysis2
XPS: PHI VersaProbe 4X-ray & Surface Analysis2
PESA: Riken AC-2 Photoelectron SpectrometerX-ray & Surface Analysis2
SIMS: Cameca NanoSIMS 50lX-ray & Surface Analysis3
SPM: Park FX-40X-ray & Surface Analysis2
SPM: Park NX-10X-ray & Surface Analysis2
SPM: Bruker Dimension IconX-ray & Surface Analysis2
SPM: Bruker Dimension IconIRX-ray & Surface Analysis2
Horiba XploRA+ RamanX-ray & Surface Analysis2
Horiba Labram RamanX-ray & Surface Analysis2
EBL: Raith EBPG 5200+Nanofabrication4
SEM: FEI Nova SEMNanofabrication4
Litho: ML3 Direct Write (365 nm)Nanofabrication4
Litho: ML3 Direct Write (385 nm)Nanofabrication4
Deposition: KJL Evaporator 1 and 2Nanofabrication4
Deposition: Cressington Sputter CoaterNanofabrication4
Deposition: Oerlikon Univex SputterNanofabrication4
Etch: Oxford PlasmaPro 80 RIENanofabrication4
Etch: Intlvac Ion MillNanofabrication4
Film Thickness: Film Sense FS-1Nanofabrication4
Film Thickness: Filmetrics F40Nanofabrication4
Profilometer: Dektak XT-S Stylus ProfilerNanofabrication4
Profilometer: KLA Tencor Alpha Step D-500Nanofabrication4
Microscopy: Keyence VK-X 3D Laser ConfocalNanofabrication4
Microscopy: Nikon LV100NDNanofabrication4
Asher: March Instruments PX-250 Plasma AsherNanofabrication4
UV: American Ultraviolet Cool Cure UV Exposure ChamberNanofabrication4
Oven: VST High Vacuum OvenNanofabrication4
Nanopatterning CleanroomNanofabrication4
Flexible CleanroomNanofabrication4
Microfab ShopNanofabrication4
Westbond Wire BonderNanofabrication2
3D PrinterNanofabrication2
Contact Angle Goniometer: Rame-Hart 290Soft & Hybrid Materials2
DLS: Brookhaven instrument Nanobrook OmniSoft & Hybrid Materials2
DMA: TA Instrument Q800Soft & Hybrid Materials2
DSC: TA Instrument Q2500Soft & Hybrid Materials2
Ellipsometer: Horiba UVISELSoft & Hybrid Materials2
RT-GPC: Tosoh Room-temperature EcoSECSoft & Hybrid Materials2
HT-GPC: Tosoh High-temperature EcoSECSoft & Hybrid Materials2
HT-TGA/DSC: TA Instrument SDT 650Soft & Hybrid Materials2
LB Trough: Biolin Scientific KSV 5000Soft & Hybrid Materials2
Mechanical Testing: Instron 5565Soft & Hybrid Materials2
Microscopy: Nikon LV100Soft & Hybrid Materials2
Oxygen Plasma Cleaner: Diener PicoSoft & Hybrid Materials2
Particle Analysis: NovaTouchSoft & Hybrid Materials2
Particle Analysis: Autosorb iQ3Soft & Hybrid Materials2
Particle Analysis: Poremaster 33Soft & Hybrid Materials2
Profilometer: Bruker Dektak XT-ASoft & Hybrid Materials2
Rheometer: TA Instrument ARES-G2Soft & Hybrid Materials2
Rheometer-DMA: TA Instrument ARES-G2Soft & Hybrid Materials2
RheosenseSoft & Hybrid Materials2
Rheosense mVROC Small-Volume ViscometerSoft & Hybrid Materials2
Spectroscopy: Agilent Cary 6000i UV/Vis/NIRSoft & Hybrid Materials2
Spectroscopy: Horiba FluoroLog FluorimeterSoft & Hybrid Materials2
Spectroscopy: Nicolet iS50 FT/IR SpectrometerSoft & Hybrid Materials2
TGA: TA Instrument Q5500Soft & Hybrid Materials2