Main content start
Leica EM TXP
Provides cutting, milling, drilling, and polishing of small samples
Eligibility
Prerequisites
Prerequisites
- Users must have an active Badger account
- Must complete Moore 184 safety orientation
- Read and understand the SOP
- Schedule and complete on in-person training session with the sample prep staff
Overview
The Leica TXP is a sample preparation tool for small samples that can cut and polish specimens for optical microscopy and scanning electron microscopy (SEM).
- Cut samples with diamond saw.
- Polish sample surface with diamond polishing foil or silicon carbide foil.
- View sample with stereo microscope during preparation.
The TXP is also used during transmission electron microscopy (TEM) sample preparation workflows. This system can mill block faces for ultra-microtome, cut/drill discs for electropolishing, and cut/polish double sided sections.
- Mill millimeter size block faces of hard material or embedded samples for ultra-microtome using milling tool and 90 degree rotation
- Cut 0.5mm thin sections for electropolisher
- Drill 3mm diameter discs for electropolisher
- Cut and polish double sided thin sections down to 20 microns
Application
Printed circuit board (PCB) cut and polished with the TXP and imaged with the Phenom Pharos SEM using the backscattered electron detector.
Application
x-ray EDS map of printed circuit board (PCB) after cutting and polishing with TXP. Map was captured using the Phenom Pharos SEM.
Mechanical Prep
Contact
TEM Staff